The issue with thin nickel is the dissolution of the copper thru the
nickel layer that will affect the intermetallic formation of the solder
to the nickel layer - this can cause a weak solder attachment to the
pad.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Wednesday, March 14, 2007 9:31 PM
To: [log in to unmask]
Subject: [TN] IPC ENIG SPECIFICATION

Hi All,
I  have a question about this specification. Obviously when the
technical
gurus wrote this they had good reasons for specifying the nickel at a
minimum of 118 microinches. One of our customers recently received some
parts from the far east. The print called for ENIG but the parts came in
with approx. 20 microinches of nickel and approx. 40 microinches of
gold.
My question is what are the reliability/solderability concerns on low
nickel. Thanks in advance. Regards Steve Kelly

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