Agree with Trikeman, the semi process is a epitaxial process using
"refractory" metal, and the asperity is not measureable on normal
tallysurfers, i.e. <0.1 um. Only situation may be with semi chips with
plated bond pads, but then we talk gold. And these have never caused us any
problems either. You needn't bother. /Inge
----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 15, 2007 1:36 PM
Subject: Re: [TN] Gold Ball Bond attaching surface roughness
Victor,
Sorry, don't have a number to give you. We do it all day long ... and
the IC mfr's know how to make the bond pads....
Typically smoother is better, but if one were to look at the plating on
a lead frame at high enough magnification, it is certainly not smooth
either.
Possibly someone has some form of spec on the surface finish of a bond
pad. All that I am aware of is pad thickness.
If no one has a surface finish number, I might be able to run some next
week.
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Thursday, March 15, 2007 8:25 AM
To: [log in to unmask]
Subject: [TN] Gold Ball Bond attaching surface roughness
Fellow TechNetters:
Typically I have observed ball bond attached the alunium window of a
chip, and copper lead frame. Are there any criteria for the roughness
of this surface for establishing a good intermetallic formation?
Victor,
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