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March 2007

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Subject:
From:
"Barmuta, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Michael
Date:
Thu, 15 Mar 2007 07:46:51 -0700
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Hi Steve: Seems like are getting a lot of replies but not much regarding
your actual question. Let me give you the short answer.

All plating is porous including nickel. Think of a sponge. Depending on
the type of plating chemistry and additives used this can be minimized
by creating denser less porous deposits. 

The thin nickel plating  will not be thick or dense enough to prevent
the copper from migrating or diffusing up thru the nickel and into the
gold. 


	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Thursday, March 15, 2007 4:32 AM
To: [log in to unmask]
Subject: Re: [TN] IPC ENIG SPECIFICATION

Thanks for the prompt reply. I can do the gold calculations - lots of
stuff on the tech-net telling me how to do that. We have not seen any
solderability issues. I would still like an explanation of the reasoning
behind the minimum nickel thickness( besides a keypad type application).
Regards Steve Kelly>

Steve,
>
> I will likely solder quite well, but the gold is quite thick for
> soldering to without incurring the wrath of gold embrittlement.  I
would
> not be so concerned about the thin nickel as the overabundance of
gold.
>
> If the gold were nice and soft, it would be nice for gold ball
bonding!
> But, the nickel is quite thin.
>
> If the numbers are correct, you did not receive ENIG - have them sent
> back
>
> Steve C
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
> Sent: Wednesday, March 14, 2007 9:31 PM
> To: [log in to unmask]
> Subject: [TN] IPC ENIG SPECIFICATION
>
> Hi All,
> I  have a question about this specification. Obviously when the
> technical
> gurus wrote this they had good reasons for specifying the nickel at a
> minimum of 118 microinches. One of our customers recently received
some
> parts from the far east. The print called for ENIG but the parts came
in
> with approx. 20 microinches of nickel and approx. 40 microinches of
> gold.
> My question is what are the reliability/solderability concerns on low
> nickel. Thanks in advance. Regards Steve Kelly
>
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