check IPC 6012 for spec... as for what is good, you have to qualify your
vendor accordingly (depend upon what class you build, reliability,
etc.etc.).
you can have the thickness meet the spec but still bad...specifically, for
aluminum wedge bond...(impurity assisted diffusion, for example..) No spec
can replace the qual...
jk
abcd
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of arnaud grivon
Sent: Thursday, March 15, 2007 8:51 AM
To: [log in to unmask]
Subject: Re: [TN] NiAu Specification for Al Wedge Wire Bonding
Thanks for the cake, but coming back to the initial question, is there
any standardisation or good practices for the NiAu plating used for Al
wedge bonding?
Best regards,
A. Grivon
Hernefjord Ingemar a écrit :
> Arnoud,
>
> There is a lot to say, I send a good cake to start with ( 4Meg offline).
> If any further questions, send smoke signal. Trikeman is guru.
> Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
> Sent: den 14 mars 2007 16:01
> To: [log in to unmask]
> Subject: [TN] NiAu Specification for Al Wedge Wire Bonding
>
> Hello TechNet,
>
> A question for wire bonding gurus (and I know there are some).
> What are the NiAu specifications adapted for Al wedge wire bonding?
> Ni & Au thicknesses, electrolytic or electroless, roughness,
> hardness....
> Are there some normalized documents covering these aspects (IPC,
> MIL...)?
> Thanks in advance.
>
> Best regards,
>
> A. Grivon
>
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