Brian:
	       It seems that there this is an oversight by the IPC. I
have found other inconsistencies and have forwarded them to IPC. Feel
free to let them know since you were the one that made the observation. 
	Some times people do not respond, because the ones that can make
comments on difficult subjects like this, are really busy and do not
check the TechNet list. 
	Regards,
	Ramon
	 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Thursday, March 15, 2007 8:40 AM
To: [log in to unmask]
Subject: [TN] Solder Purity


Good morning,
      A little over a week ago I posed a question regarding solder
purity
   and a perception of conflict between J-STD 001 & J-STD 006. Luck was
not
   with me as there were no replies. Alas, I will try one more time in
   hopes that the tech gurus here can provide some insight or solutions
   based on similar experience.

   Previous post:

   I am hoping that someone can help us with a clarification regarding
   solder purity/composition requirements. Specifically the following:

   ANSI J STD 006 on page 3 lists allowable impurities in the solder
alloy
   when purchased. One component in particular is indium @ 0.10
allowable
   limit.
   However, ANSI J STD 001 which is the assembly specification used in
   daily production lists on page 5 allowable solder impurities which
does
   not include/allow Indium.
   ANSI J STD 001 which is also the specification used for testing lists
on
   page 5 allowable solder impurities which also does not allow Indium.

   Perhaps we are interpreting the sentence associated with the table on
   both 001 and 003 wrong, however the sentence does state:  "the
balance
   of the bath shall be lead and/or the items listed above." How can you
   allow Indium in the raw purchased solder and not allow it in the
   production solder?

   Thank you in advance for your thoughts and clarifications.



Brian Guidi
Senior Product Engineer / N.P.I.
Teledyne Printed Circuit Technology
Tel: (603) 889-6191  X:310
Fax: (603) 886-2977
E-mail: [log in to unmask]

Visit us @ http://www.tetpct.com

Any technical information attached to this document is intended for the
recipient only.  Also, the export and use of the information is
regulated by the export laws of the United States.  Diversion contrary
to U.S. law is prohibited.  U.S. law prohibits sharing this information
with any end-user for any end-use related to the design, development,
production, stockpiling or use of chemical, biological or nuclear
weapons or missiles, without the prior approval of the United States
Government.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------