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March 2007

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Subject:
From:
Joyce Koo <[log in to unmask]>
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Date:
Thu, 15 Mar 2007 08:52:21 -0500
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Steve,
you might have "nice and soft gold" on day one upon receiving... but not
long...Assume you have JIT... I mean really JIT (just in hrs, may
be...hehehe) for wire bond, it would be OK...
                                jk (even in the old weather here... I
wouldn't use 20 micro-inches Ni)

abcd

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Creswick, Steven
Sent: Thursday, March 15, 2007 5:04 AM
To: [log in to unmask]
Subject: Re: [TN] IPC ENIG SPECIFICATION


Steve,

I will likely solder quite well, but the gold is quite thick for
soldering to without incurring the wrath of gold embrittlement.  I would
not be so concerned about the thin nickel as the overabundance of gold.

If the gold were nice and soft, it would be nice for gold ball bonding!
But, the nickel is quite thin.

If the numbers are correct, you did not receive ENIG - have them sent
back

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Wednesday, March 14, 2007 9:31 PM
To: [log in to unmask]
Subject: [TN] IPC ENIG SPECIFICATION

Hi All,
I  have a question about this specification. Obviously when the
technical
gurus wrote this they had good reasons for specifying the nickel at a
minimum of 118 microinches. One of our customers recently received some
parts from the far east. The print called for ENIG but the parts came in
with approx. 20 microinches of nickel and approx. 40 microinches of
gold.
My question is what are the reliability/solderability concerns on low
nickel. Thanks in advance. Regards Steve Kelly

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