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Date: | Thu, 15 Mar 2007 08:39:32 -0400 |
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Good morning,
A little over a week ago I posed a question regarding solder purity
and a perception of conflict between J-STD 001 & J-STD 006. Luck was not
with me as there were no replies. Alas, I will try one more time in
hopes that the tech gurus here can provide some insight or solutions
based on similar experience.
Previous post:
I am hoping that someone can help us with a clarification regarding
solder purity/composition requirements. Specifically the following:
ANSI J STD 006 on page 3 lists allowable impurities in the solder alloy
when purchased. One component in particular is indium @ 0.10 allowable
limit.
However, ANSI J STD 001 which is the assembly specification used in
daily production lists on page 5 allowable solder impurities which does
not include/allow Indium.
ANSI J STD 001 which is also the specification used for testing lists on
page 5 allowable solder impurities which also does not allow Indium.
Perhaps we are interpreting the sentence associated with the table on
both 001 and 003 wrong, however the sentence does state: “the balance
of the bath shall be lead and/or the items listed above.” How can you
allow Indium in the raw purchased solder and not allow it in the
production solder?
Thank you in advance for your thoughts and clarifications.
Brian Guidi
Senior Product Engineer / N.P.I.
Teledyne Printed Circuit Technology
Tel: (603) 889-6191 X:310
Fax: (603) 886-2977
E-mail: [log in to unmask]
Visit us @ http://www.tetpct.com
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