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March 2007

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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Thu, 15 Mar 2007 06:32:09 -0500
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Thanks for the prompt reply. I can do the gold calculations - lots of
stuff on the tech-net telling me how to do that. We have not seen any
solderability issues. I would still like an explanation of the reasoning
behind the minimum nickel thickness( besides a keypad type application).
Regards Steve Kelly>

Steve,
>
> I will likely solder quite well, but the gold is quite thick for
> soldering to without incurring the wrath of gold embrittlement.  I would
> not be so concerned about the thin nickel as the overabundance of gold.
>
> If the gold were nice and soft, it would be nice for gold ball bonding!
> But, the nickel is quite thin.
>
> If the numbers are correct, you did not receive ENIG - have them sent
> back
>
> Steve C
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
> Sent: Wednesday, March 14, 2007 9:31 PM
> To: [log in to unmask]
> Subject: [TN] IPC ENIG SPECIFICATION
>
> Hi All,
> I  have a question about this specification. Obviously when the
> technical
> gurus wrote this they had good reasons for specifying the nickel at a
> minimum of 118 microinches. One of our customers recently received some
> parts from the far east. The print called for ENIG but the parts came in
> with approx. 20 microinches of nickel and approx. 40 microinches of
> gold.
> My question is what are the reliability/solderability concerns on low
> nickel. Thanks in advance. Regards Steve Kelly
>
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