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March 2007

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Subject:
Re: NiAu Specification for Al Wedge Wire Bonding
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Wed, 14 Mar 2007 16:45:22 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (49 lines) 
Arnoud,

There is a lot to say, I send a good cake to start with ( 4Meg offline).
If any further questions, send smoke signal. Trikeman is guru.
Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: den 14 mars 2007 16:01
To: [log in to unmask]
Subject: [TN] NiAu Specification for Al Wedge Wire Bonding

Hello TechNet,

A question for wire bonding gurus (and I know there are some).
What are the NiAu specifications adapted for Al wedge wire bonding?
Ni & Au thicknesses, electrolytic or electroless, roughness,
hardness....
Are there some normalized documents covering these aspects (IPC,
MIL...)?
Thanks in advance.

Best regards,

A. Grivon

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