Eric: Immersion, electroless and thinner electroplatings in the 0.1-5.0
micron range are typically measured using XRF (X-Ray Fluorescence).
Thicker platings 5 micron and greater are normally cross-sectioned and
optically examined
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: Tuesday, March 13, 2007 9:27 AM
To: [log in to unmask]
Subject: Re: [TN] PCB plating Qualification
I apologise in advance for taking this thread off on a slight tangent
but how do you check sub micron plating thickness to any degree of
accuracy? I have often been told that it is very difficult to do.
Kane, Amol (349) wrote:
> In case of ENIG, the Ni and the Au thickness would be important too
wont it?.....the idea here is (or what I thought would be) is to monitor
the plating process of the supplier and compare it to the max and min
specs of Ni and Au given in 4552 to ensure that you consistently get
boards that will not be susceptible to Au embrittlement on one end to
black pad on the other........seemed logical to me, and therefore wanted
to know if this was a practice in the industry........
>
> Amol
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
> Sent: Tuesday, March 13, 2007 10:27 AM
> To: [log in to unmask]
> Subject: Re: [TN] PCB plating Qualification
>
> Hi Amol,
> I would be very much surprised if there were such efforts. Why
undertake such
> an effort?
> The only plating thickness that is really critical is the copper
plating
> thickness in the vias-and it will vary according to all kinds of
variables.
>
> Werner
>
>
>
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Eric Christison Msc
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Home Personal, Communication Sector
Imaging Division
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