I apologise in advance for taking this thread off on a slight tangent 
but how do you check sub micron plating thickness to any degree of 
accuracy? I have often been told that it is very difficult to do.

Kane, Amol (349) wrote:
> In case of ENIG, the Ni and the Au thickness would be important too wont it?.....the idea here is (or what I thought would be) is to monitor the plating process of the supplier and compare it to the max and min specs of Ni and Au given in 4552 to ensure that you consistently get boards that will not be susceptible to Au embrittlement on one end to black pad on the other........seemed logical to me, and therefore wanted to know if this was a practice in the industry........
>
> Amol
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
> Sent: Tuesday, March 13, 2007 10:27 AM
> To: [log in to unmask]
> Subject: Re: [TN] PCB plating Qualification
>
> Hi Amol,
> I would be very much surprised if there were such efforts. Why undertake such
> an effort?
> The only plating thickness that is really critical is the copper plating
> thickness in the vias-and it will vary according to all kinds of variables.
>
> Werner
>
>
>
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-- 
Eric Christison Msc
Mechanical Engineer
Home Personal, Communication Sector
Imaging Division

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