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March 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 13 Mar 2007 10:27:10 EDT
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Hi Amol,
I would be very much surprised if there were such efforts. Why undertake such 
an effort? 
The only plating thickness that is really critical is the copper plating 
thickness in the vias—and it will vary according to all kinds of variables.

Werner



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