Hi Wayne, Matt: In this particular case I would say that the vendor is
not liable.
This was a new vendor. If you had "qualified" this vendor prior to
production to build the boards in a particular way or call out and they
then sent you boards that did not meet the pre-agreed criteria, then you
would have a case. However this is not how I read situation. I didn't
see anything that said they did not build to print.
You basically get boards from a new vendor and they give you problems
with your process. Not all board fabricators know the limitations of
your processes. Some are better than others.
You need to contact the vendor and discuss the problem, work out an
acceptable solution and document it on the drawing.
If it's a good vendor that wants your business there may be a middle
ground for $cost on a remake or future credit.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Monday, March 12, 2007 12:50 PM
To: [log in to unmask]
Subject: Re: [TN] Paste Volume, off contact vs non off contact
I would say it was the vendor's liability, because they did something
which restricted the way the boards could be handled without first
getting an OK from their customer. Sure, the vendor could say that they
didn't think you'd use a stencil for the BGA, but they should've
contacted you if they processed the board in such a way as to preclude
you from using a stencil, which is the industry's standard operating
procedure.
Wayne Thayer
>>> [log in to unmask] 3/12/2007 8:50:23 am >>>
Guy/Gals,
Thanks for the solutions to the problem. I know how to fix it in the
future.
The question I am trying to answer does not have anything to do with
how to
fix the problem.
The question is quite simply, if a vendor supplied boards with this
condition, and it resulted in scrap/rework, would you consider that
your
liability or theirs?
mk
\Matt Kehoe
SIPAD Systems Inc
"The Original Solid Solder Deposit"
360-C Winkler Drive
Alpharetta, GA. 30004
770-475-4576
770-475-1597 fax
www.sipad.com
[log in to unmask]
Please note, Matt Kehoe's E-mail has changed from
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This new email is heavily filtered for spam. If your email is bounced,
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----- Original Message -----
From: "Bill Kunkle" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 09, 2007 2:11 PM
Subject: Re: [TN] Paste Volume, off contact vs non off contact
> Matt,
>
> I agree with Bill C, stencil relief pockets at the via locations will
> allow
> the high points to be accepted into the bottom of the foil.
>
> Bill Kunkle
> MET Assocs
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Matt Kehoe
> Sent: Friday, March 09, 2007 12:01 PM
> To: [log in to unmask]
> Subject: [TN] Paste Volume, off contact vs non off contact
>
>
> We have been processing a family of boards for 3 years. No issues.
New PCB
> Vendor and the boards suddenly will not print very well. Sloppy
printing
> definition. Heavy heavy deposition.
>
> Closer inspection reveals that the soldermask is built up .0012-.0019
over
> the vias, preventing the stencil from gasketing. Vendor claims they
are
> built to print.. Opinions?
>
> Pictures at ;
> http://www.sipad.com/ssiqa/3942vias.pdf
> http://www.sipad.com/ViasBuildup.pdf
>
> The question we are trying to answer is, if your boards came in with
mask
> this thick over the vias would you feel confident in running them
without
> modifing the stencil? Would you expect a significant increase in
solder
> volume?
>
>
> mk
>
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