Is that increase the RoR, or increase the time (and decrease the RoR?)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerard O'Brien
Sent: Monday, March 12, 2007 12:22 PM
To: [log in to unmask]
Subject: Re: [TN] FR408 vs. FR-4 in RoHS Compliant SMT Process

Dale - one of our customers suffered the same problem with boards
supplied
by both us and another supplier - common factor being 408. The
recommendation from Isola to date has been to increase the rate of rise
of
the profile during reflow. Testing has shown that it is not the max
temperature exposure but rather the rate of rise.

Regards

Gerard O'Brien
Dir of Material Test, Reliability and Technology
Photocircuits Corporation

-----Original Message-----
From: Dale Ritzen [mailto:[log in to unmask]] 
Sent: Monday, March 12, 2007 11:22 AM
To: [log in to unmask]
Subject: [TN] FR408 vs. FR-4 in RoHS Compliant SMT Process

We have a customer that is experiencing delamination issues with the
FR408
material they have specified for use on one of their circuit boards.
They
have recently gone RoHS compliant with Pb-free solders and the
associated
rise in reflow temperatures seems to have created this problem. Does
anyone
have any experience with mitigating this problem, or can you suggest a
better PCB platform instead of FR408 for high frequency signal
resolution/internal impedance control applications at higher reflow
temperatures?

Thanks,
Dale Ritzen
Quality Manager
Austin Manufacturing Services

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