Guy/Gals,
Thanks for the solutions to the problem. I know how to fix it in the future.
The question I am trying to answer does not have anything to do with how to
fix the problem.
The question is quite simply, if a vendor supplied boards with this
condition, and it resulted in scrap/rework, would you consider that your
liability or theirs?
mk
\Matt Kehoe
SIPAD Systems Inc
"The Original Solid Solder Deposit"
360-C Winkler Drive
Alpharetta, GA. 30004
770-475-4576
770-475-1597 fax
www.sipad.com
[log in to unmask]
Please note, Matt Kehoe's E-mail has changed from
[log in to unmask] to [log in to unmask]
This new email is heavily filtered for spam. If your email is bounced,
forward the bounce back text to [log in to unmask] and your account will
be unblocked.
Thank you for your patience in helping SIPAD Systems combat spam.
----- Original Message -----
From: "Bill Kunkle" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 09, 2007 2:11 PM
Subject: Re: [TN] Paste Volume, off contact vs non off contact
> Matt,
>
> I agree with Bill C, stencil relief pockets at the via locations will
> allow
> the high points to be accepted into the bottom of the foil.
>
> Bill Kunkle
> MET Assocs
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Matt Kehoe
> Sent: Friday, March 09, 2007 12:01 PM
> To: [log in to unmask]
> Subject: [TN] Paste Volume, off contact vs non off contact
>
>
> We have been processing a family of boards for 3 years. No issues. New PCB
> Vendor and the boards suddenly will not print very well. Sloppy printing
> definition. Heavy heavy deposition.
>
> Closer inspection reveals that the soldermask is built up .0012-.0019 over
> the vias, preventing the stencil from gasketing. Vendor claims they are
> built to print.. Opinions?
>
> Pictures at ;
> http://www.sipad.com/ssiqa/3942vias.pdf
> http://www.sipad.com/ViasBuildup.pdf
>
> The question we are trying to answer is, if your boards came in with mask
> this thick over the vias would you feel confident in running them without
> modifing the stencil? Would you expect a significant increase in solder
> volume?
>
>
> mk
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
