I can relate!!!!!!!!!!!!!

Matt Kehoe
SIPAD Systems Inc
"The Original Solid Solder Deposit"
360-C Winkler Drive
Alpharetta, GA. 30004
770-475-4576
770-475-1597 fax
www.sipad.com
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----- Original Message ----- 
From: "BADRI" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 09, 2007 11:21 PM
Subject: Re: [TN] Paste Volume, off contact vs non off contact


> Dear MK,
>
> We had this issue in one of our boards. Hell broke out during paste
> application in terms of sloppy and insufficient prints. Avoid them as much
> as possible.
>
> Badri
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Matt Kehoe
> Sent: Friday, March 09, 2007 10:31 PM
> To: [log in to unmask]
> Subject: [TN] Paste Volume, off contact vs non off contact
>
> We have been processing a family of boards for 3 years. No issues. New PCB
> Vendor and the boards suddenly will not print very well. Sloppy printing
> definition. Heavy heavy deposition.
>
> Closer inspection reveals that the soldermask is built up .0012-.0019 over
> the vias, preventing the stencil from gasketing. Vendor claims they are
> built to print.. Opinions?
>
> Pictures at ;
> http://www.sipad.com/ssiqa/3942vias.pdf
> http://www.sipad.com/ViasBuildup.pdf
>
> The question we are trying to answer is, if your boards came in with mask
> this thick over the vias would you feel confident in running them without
> modifing the stencil? Would you expect a significant increase in solder
> volume?
>
>
> mk
>
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