Technet and DesignersCouncil Gurus -

I have been asked by our mechanical engineering group to find out if
there is a standard or specification for post assembly flatness of
printed circuit cards.  This has never been an issue for functional
failure but a new design requires that a row of LEDs mate to a display
panel mask such that no light leaks from one LED cell to the next. Their
concern is that post assembly bow and twist will over stress solder
joints and board copper if they mechanically stress the cards by
pressing/pulling them flat to an assembly frame.  Can anyone direct me
to a standard or advise me on the maximum allowable bow and twist for
this type of situation?


Jeffrey McGlaughlin, CID 
Engineering Designer 
Battelle 
505 King Avenue 
Columbus Ohio 43201-2693 
(614)424-7582 Phone 
(614)458-7582 Fax 

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