In a message dated 3/7/2007 6:52:17 AM Pacific Standard Time,  
[log in to unmask] writes:

Could  any of you share your experiences in terms of processing and 
reliability  of the solder coated polymer core BGA solder balls 


 
Hi Werner, 
 
I think Motorola has done some work in this area and showed improvement.  
They presented some data at a Tessera sponsored  symposium during Semicon. 
 
Very best, 
Joe  

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