Ralph: Blisters and delamination are just that. They are areas where the
soldermask is separated i.e. not bonded to the surface of the PCB.
Although they may not be the best, paragraph 2.9.4 has example pictures

It can be caused by a variety of things, contamination on the board
surface, wrong solvent, incorrect proportioning or mixing of mask
components, too high/too low cure temperature, moisture, high process
temperatures, etc.

The areas typically are raised and lighter in appearance than the
surrounding soldermask due to the air pocket between the mask and board
surface.


	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ralph Richart
Sent: Monday, March 19, 2007 8:58 AM
To: [log in to unmask]
Subject: [TN] Soldermask Blisters

IPC A-600, section 2.9.4 refers to Blisters/Delamination in Soldermask.

I am looking for clarification as to what these actually are?  How do
they manifest themselves?  I can't say I've ever seen one, so I am
trying to know what one would look like if I hade seen one.

thanks

Ralph

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