You are correct Louis; I confused high Pb with high Sn, see attached!
I corrected my previous email below. It does not change the outcome.
Thank you for correcting my previous comment,
Paymon
-----Original Message-----
From: Louis, Edwin @ CSE [mailto:[log in to unmask]]
Sent: March 28, 2007 12:57 PM
To: TechNet E-Mail Forum; Paymon Sani
Subject: RE: [TN] COMPATIBILITY
The melting point of Tin is 232 degrees C.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Wednesday, March 28, 2007 11:58 AM
To: [log in to unmask]
Subject: Re: [TN] COMPATIBILITY
You are creating 2 solder joints:
1- Soldering to component leads:
Assumption is that the component lead has Sn finish,
- Sn has a melting point at 232C
- Assuming a lead-free reflow temp in the mid 200s
- The resultant will be a solder joint with SnNi intermetalic
2- Soldering to the PCB:
Assumption is that the PCB has ENIG surface finish
- Gold will dissipate in the solder
- The resultant will be a solder joint with SnNi intermetalic
I am not aware of any concern with the above solder joints. Watch the
quality of the ENIG finish as it is less forgiving when used with lead
free assembly process at elevated reflow temperature.
Hope this helps,
Paymon Sani
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI
Sent: March 28, 2007 10:07 AM
To: [log in to unmask]
Subject: [TN] COMPATIBILITY
Hello all,
1. Process: lead free (SAC 305) solder paste
2. fine pitch component (QFP)termination finish: SN /NI/Pd/CU
3. PCB pads: ENIG
Requesting every one to comment on the above combination. Will I have
any
major issues post reflow.?
Thanx
Badri
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