Hi Amol: Unless I missed something you are actually soldering to the
nickel not the beryllium Cu substrate.
You do not say what type of nickel or thickness of nickel your are
trying to solder to i.e. electroless, electroplated, heat treated,
alloyed, etc. However in general, nickel is difficult to solder due to
the formation of tenacious oxides on it's surface.
The NC flux you are using is probably insufficient in strength to clean
and activate the nickel to allow proper wetting. You can go to a
stronger flux system such as an organic acid (OA)but this must be
thoroughly washed off or it will leave corrosive residues.
You can also use mechanical cleaning/abrasion to remove the oxides and
prep the surface. However I would not recommend it. The abrasive media
can get imbedded into the surface and if not completely removed make the
situation worse.
All the major solder/flux suppliers carry various OA fluxes and can help
you with your application.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Wednesday, March 28, 2007 7:59 AM
To: [log in to unmask]
Subject: [TN] Soldering to Beryillum Copper
Dear Members,
I am trying to hand solder to a substrate that, I have been told is Ni
plated Beryllium Copper with SnPb no clean process (it is actually for a
battery termination). Are there special considerations involved when
soldering to this substrate? I am having a hard time getting the solder
to wet and stick to the substrate. It just balls up (doesn't stick) and
refuses to form a bond. I have already tried cleaning the area with
alcohol without success.
Any pointers/information that I am not aware of?
Thanks in advance,
Amol
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, May 05, 2006 8:05 AM
To: [log in to unmask]
Subject: Re: [TN] PWB de-paneling
Hi Sumx:
Drill holes, in the center of the joints forming a
line (tabs, become mouse bites). Holes should be made by a drill whose
diameter is smaller than the width of the joints with a gap of about 100
mills from adjacent sides. Bend the tabs 30 degrees towards one side and
then the opposite side, repeat till the tabs break off. Pull tab away
from the board. Note: do not bend to one side and pull. It is still
attached from one side and it will tear off glass fibers. The bend must
be made to one side and to the other and repeat till the tabs breaks
off. Pull tab away from the board and not in the direction the top or
bottom of the board is facing.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sumxplore
Sent: Thursday, May 04, 2006 10:47 AM
To: [log in to unmask]
Subject: Re: [TN] PWB de-paneling
I received a board without v-score but with 2 joints.Any idea how to
singulate it as the board with csp around 8mils from the edge or any
suggestion on how to redesign the boards for manufacturability.
Appreciate any input.Thanks in advance.
rgds
sumxp
----- Original Message -----
From: "Lee Parker" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, May 04, 2006 3:35 AM
Subject: Re: [TN] PWB de-paneling
> Victor
>
>
>
> Your boards may have been scored and the sheared or even punched when
> they were depanelized. Punching is not uncommon in Asia even for
> multilayer boards. In Asia the standard is what ever you specify. If
> left unspecified all things are possible.
>
>
>
> Best regards
>
>
>
> Lee
>
>
>
> J. L. Parker Ph.D.
>
> JLP Consultants LLC
>
> (804) 779 3389
>
>
>
>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G.
> Hernandez
> Sent: Tuesday, May 02, 2006 11:33 AM
> To: [log in to unmask]
> Subject: [TN] PWB de-paneling
>
>
>
> Fellow TechNetters:
>
>
>
> What are some common acceptable practices for de-paneling PWB?
>
> I am more familiar with routing, which provides a smooth edge with
> good
>
> quality control.
>
>
>
> I have observed some PWB from overseas suppliers with an edge that
>
> appears snapped with frayed edges.
>
> Is this in according with IPC Standards?
>
>
>
> Victor,
>
>
>
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