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March 2007

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Subject:
From:
Paymon Sani <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paymon Sani <[log in to unmask]>
Date:
Thu, 22 Mar 2007 09:32:21 -0400
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Peter,

 

I do not have experience on the Black Pad issue. My mentor was dealing
with Black Pad at the start of my career. Are the non-wetting pads dark
color? Are they rich in Carbon content? If yes, it may be the result of
high carbon concentration. It can be reworked by aggressive flux, high
heat and mechanical action to remove the carbon compound before exposing
the good nickel for soldering. Please see below on Black Pad:

 

Phosphorous enrichment is an indicator of black pad corrosion because
the nickel is depleted at the corrosion sites leaving that portion of
the plating phosphorous rich. Roger Jay & Alfred Kwong, "DEALING WITH
THE 'BLACK PAD DEFECT'-

A FAILURE ANALYST'S PERSPECTIVE" Solectron Corporation, September 2001.

 

 

-----Original Message-----
From: Miguel Vallejo [mailto:[log in to unmask]] 
Sent: March 21, 2007 5:21 PM
To: 'TechNet E-Mail Forum'; Paymon Sani
Subject: RE: [TN] Solderability problems on through holes only.

 

Paymon,

Isn't this phosphor starvation what causes "black pad".

 

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani

Sent: Wednesday, March 21, 2007 2:02 PM

To: [log in to unmask]

Subject: Re: [TN] Solderability problems on through holes only.

 

Hello Peter,

 

 

 

I have not looked at the suspect assemblies. However, this defect can

occur when the Nickel under the gold is oxidized prior to the TH

component assembly process. The electroless nickel is not pure and it

contains 10 to 14 percent phosphorus by weight. The nichel-phosphorus is

a good diffusion barrier to avoid corrosion of the solderable surface.

If the phosphor content is low i.e. 3 to 5% by weight then the

solderable surface will oxidize by each reflow heat application. The

oxidize nickel will then prevent soldering to the surface. The link

below is a good read on the ENIG surface finish.

 

 

 

http://www.pfonline.com/articles/129901.html

 

 

 

The assemblies should be reworkable with aggressive water soluble

fluxes, some mechanical action and a suitable soldering iron tip

temperature.

 

 

 

Hope this helps,

 

Paymon

 

 

 

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Wong

Sent: March 21, 2007 4:18 PM

To: [log in to unmask]

Subject: [TN] Solderability problems on through holes only.

 

 

 

Hi Technetters,

 

 

 

 

 

 

 

We are having a solderability problem confined to only through hole

 

locations where we need some help or advice.  

 

 

 

 

 

 

 

We are soldering a no-clean SAC305 alloy to an ENIG finished board.  All

 

SMT solder joints (both sides) are fine.  During hand soldering in our

 

dedicated lead free area, we are having problems with solder wetting to

 

some of the annular rings and barrels of through hole locations, not all

 

holes.  The assembly is an 0.062" thick 4 layer 1"x1" board so it is not

 

thermally challenging.

 

 

 

 

 

 

 

We've built thousands of these in the past without this particular

 

problem.

 

 

 

 

 

 

 

The time lag between smt and through hole assembly is 1-2 days.

 

 

 

 

 

 

 

We've tried using a more aggressive flux such as OA flux with no

 

improvement.

 

 

 

The only way that we can get solder to wet is to mechanically scrape the

 

annular rings with a pick.  

 

 

 

 

 

 

 

Has anyone seen this before?  Why would this only occur on some of the

 

through hole locations and not on smt pads?

 

 

 

 

 

 

 

We have isolated this to a specific lot code of boards and are waiting

 

for some advice from our board vendor as well.

 

 

 

 

 

 

 

Thanks

 

 

 

Peter

 

 

 

 

 

 

 

 

 

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