N'ya pas A.
You can only speak in general terms. Usually, you can't ask for special finish for your wire bonding. Instead, you have to adopt your bonding to the standard boards you get from the board maker. I can just give you example on common properties:
Electro full additive Au/Ni plating = 0.5 - 1.0 micrometers of gold over minimum 2.0 micrometers of nickel.
Electroless Nickel/Immersion Gold = 2-10 micrometers of nickel, overplated with 0.05-0.15 micrometers of gold.
A number of parameters will then (have to) be examined in bonding point of view: board thickness, surface microhardness, surface asperity, cleanliness, wire diameter, wire microhardness, wedge or capillary selection and...think I have a fishbone somewhere. So, if you Al wedge with a tungsten tool and 150 um wire, you will bond to nearly any NiAu treatment, but with thinner wires, some problems may occur. As an example, we got bond problems with a teflon based board. The bondpad jazzed with the U/S music and there was no good adhesion. Doubling the nickel thickness made the bondpad more stable, and the bond problem vanished. If you are a small customer, there may be some trouble to have the big board manufacturer to make such specials.
Ericsson have bonded approx. 2 million ENIG boards the last years, with mixed Al wire diameter, but it wasn't without problems when started. Those boards fall within the second category above.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: den 15 mars 2007 14:51
To: [log in to unmask]
Subject: Re: [TN] NiAu Specification for Al Wedge Wire Bonding
Thanks for the cake, but coming back to the initial question, is there any standardisation or good practices for the NiAu plating used for Al wedge bonding?
Best regards,
A. Grivon
Hernefjord Ingemar a écrit :
> Arnoud,
>
> There is a lot to say, I send a good cake to start with ( 4Meg offline).
> If any further questions, send smoke signal. Trikeman is guru.
> Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
> Sent: den 14 mars 2007 16:01
> To: [log in to unmask]
> Subject: [TN] NiAu Specification for Al Wedge Wire Bonding
>
> Hello TechNet,
>
> A question for wire bonding gurus (and I know there are some).
> What are the NiAu specifications adapted for Al wedge wire bonding?
> Ni & Au thicknesses, electrolytic or electroless, roughness,
> hardness....
> Are there some normalized documents covering these aspects (IPC,
> MIL...)?
> Thanks in advance.
>
> Best regards,
>
> A. Grivon
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
