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Date: | Tue, 13 Mar 2007 14:09:45 +0000 |
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Presumably the balls are too close together to get a track through to
the centre? Why don't you ask the manufacturer how you're supposed to do it?
It might make them come up with a better layout next around (this wasn't
made by my company I hope?).
Regards,
Upton, Shawn wrote:
> I am looking at a part with 0.2mm balls on the bottom, in a 3x3 pattern.
> I need to get a trace to the center ball, but one of the outer balls is
> not in use. I'm thinking of just running the trace under the solder
> ball and counting on the soldermask to prevent the ball from attaching
> to the PCB. Good/bad? I'm a bit worried that when the solderballs
> reflow, the lack of a pad under the unused solderball might cause that
> side of the part to sit higher, as there wasn't a pad to wick away that
> solder.
>
Eric Christison Msc
Mechanical Engineer
Home Personal, Communication Sector
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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