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March 2007

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 13 Mar 2007 07:18:07 -0400
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text/plain
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Dear Members,
Is anybody out there looking at statistical data (control charts, Cp, Cpk values) of plating thicknesses processes for say, ENIG and evaluating your board house/s on it? Are there any procedures (IPC or otherwise) for doing so? what matrices can be reasonably achieved for plating processes? If this analysis is looked it, is it just a one time deal or is this a recurrent activity (like every 6 months or 1 year or some other time period)

Wanted to know the general trend in the industry.

Thanks in advance,
Amol





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