Hi Werner,
We have attached these polymer core solder balls to daisy chain
components many times.  I do not recall if it was for the same customer
or several.  From a production point of view they have been very good.
No problems with the attach process, wetting is superb, and no
dissolution of the copper layer. Keep in mind that since they do not
reflow, the alignment (and cost) is similar to high-Pb.  I will also
check to see whether we attached with Sn63 or SAC.  Most likely they
were attached with Sn63 so the data may not be useful to you.  If your
application allows Pb then why not just use High-Pb balls.

The 2nd-level rel testing was performed by the customer(s).  Although I
cannot reveal their name(s) I will research, e-mail them, and ask them
if they would be so kind as to contact you.

Regards,
Russ Winslow
www.solderquik.com


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, March 07, 2007 6:50 AM
To: [log in to unmask]
Subject: [LF] Polymer Core BGA Balls

Hi 'Netters,
Could any of you share your experiences in terms of processing and 
reliability of the solder coated polymer core BGA solder balls
apparently made by 
Sekisui Chemical Co. Ltd. and sold in the US by Kyocera. There were some

presentatiobns by Kyocera in 2004, but I have not heard anything about
them since.

Werner

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