Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 7 Mar 2007 17:55:45 EST |
Content-Type: | text/plain |
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Be careful,
What the paste manufacturers recommend in terms of reflow profile has little
to do with soldering, but a lot to do with their flux formulation. Its a
cart-before-the-horse situation.
RSS [ramp-soak-spike] should always be preferred, but particularly for the
higher T's needed for SAC-soldering, because it minimizes thermal gradients, and
thus warpage. There is really no redeeming recommendation to be made for RTS
[ramp-to-spike], unless your assembly only has lots of small parts of roughly
the same [thermal] size.
Werner
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