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March 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 7 Mar 2007 17:55:45 EST
Content-Type:
text/plain
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text/plain (26 lines)
Be careful, 
What the paste manufacturers recommend in terms of reflow profile has little 
to do with soldering, but a lot to do with their flux formulation. Its a 
cart-before-the-horse situation.
RSS [ramp-soak-spike] should always be preferred, but particularly for the 
higher T's needed for SAC-soldering, because it minimizes thermal gradients, and 
thus warpage. There is really no redeeming recommendation to be made for RTS 
[ramp-to-spike], unless your assembly only has lots of small parts of roughly 
the same [thermal] size.

Werner



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