I'll say no rhyme
Before it's thyme
Or any seasoning
Without Dew reasoning
I'm through now or at least until Friday. With any luck I'll be getting
a new MV Agusta. The only thing I'll be recycling is great roads and not
my humor.
Dewey
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Wednesday, March 07, 2007 2:40 PM
To: (Leadfree Electronics Assembly Forum); Whittaker, Dewey (EHCOE)
Subject: RE: [LF] Polymer Core BGA Balls
Whether called a CCGA;
A compliant column grid array,
Or be it called a CCGA,
Ceramic Column grid array,
Even, if you prefer, CCGA,
Copolymer Core grid array,
It will thus live, I really must say,
Without cracking again on another day.
Unless, of course, should you strip away,
It's lead, within, the solder arrayed,
Then watch it tumble from the sky,
In an Aerbus full, as the Parliament cries,
"For a RoHS is a RoHS, by any other name,
and its not our fault, we're not to blame!"
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, March 07, 2007 3:13 PM
To: [log in to unmask]
Subject: Re: [LF] Polymer Core BGA Balls
Which would be a CCGA (compliant column grid array).
Do you have words to trim
Then create another acronym
Though chances are slim
To find another for synonym
Dewey
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, March 07, 2007 1:37 PM
To: [log in to unmask]
Subject: Re: [LF] Polymer Core BGA Balls
Which I believe actually describes a larger version of ACF bonding of a
flip
chip....................?
John
John Burke
(408) 515 4992
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Wednesday, March 07, 2007 12:21 PM
To: [log in to unmask]
Subject: Re: [LF] Polymer Core BGA Balls
Hi Richard,
Thanks for the link. It appears that Motorola's focus and claims were
around
a polymer column.
Tessera disclosed and patented a polymer ball concept in the same
general
time frame.
The operative sentence is "each conductive element 26 incorporates a
flexible body 28 covered by a thin, flexible conductive shell 30"
The first claim reads
1. A method of making a semiconductor chip assembly comprising the
steps
of:
(a) providing a plurality of deformable electrically conductive
elements,
each including a thin, flexible metallic shell extending over at least
a
portion of the surface of the conductive element, and mounting said
conductive
elements to contacts on a chip so that the metallic shells are exposed;
then
(b) connecting the chip to a substrate by metallurgically bonding the
conductive elements to contact pads on the substrate.
I suspect that there are a number of other concepts out there as well.
Very best,
Joe
<BR><BR><BR>**************************************<BR> AOL now offers
free
email to everyone. Find out more about what's free from AOL at
http://www.aol.com.
------------------------------------------------------------------------
----
---Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send:
SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
------------------------------------------------------------------------
----
---
------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------
------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
