I believe RSS or RTS is more dependent on thermal loading, Delta T and
flux activity, not necessarily Lead free or Tin/Lead process. Granted, a
LF process makes the factors above more critical, as your process window
has narrowed.
This is an application specific decision and there isn't a rule of thumb
(such as LF use RSS and Tin/Lead use RTS)
I have noticed that many paste manufacturers that initially recommended
RSS, are now also recommending RTS. Like anything else, paste
formulation will continue to evolve.
Regards,
LS
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Brandon Zimmer
Sent: Wednesday, March 07, 2007 3:59 PM
To: [log in to unmask]
Subject: Reflow profile style (RSS vs. RTS)
We are beginning to test some lead-free products and one of the
parameters =
I am curious about is reflow profiling, specifically the differences
betwee=
n ramp-soak-spike and ramp-to-spike.
=20
Has anyone moved from a RSS to RTS because of the switch to lead-free
solde=
r? Or vice-versa?
=20
I would appreciate any information.
=20
Thanks,
Brandon Zimmer
PCB Production Engineering
New Sabina Industries, Inc.
=20
=20
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