Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 7 Mar 2007 15:58:51 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
We are beginning to test some lead-free products and one of the parameters I am curious about is reflow profiling, specifically the differences between ramp-soak-spike and ramp-to-spike.
Has anyone moved from a RSS to RTS because of the switch to lead-free solder? Or vice-versa?
I would appreciate any information.
Thanks,
Brandon Zimmer
PCB Production Engineering
New Sabina Industries, Inc.
The information in this eMail and any attachments therein is confidential and for use by the addressee only. If you are not the intended recipient please return the eMail to the sender and delete it from your computer. Although New Sabina attempts to sweep eMail and attachments for viruses New Sabina does not guarantee that either are virus free and accept no liability for any damage sustained as a result of viruses.
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
|
|