LEADFREE Archives

March 2007

Leadfree@IPC.ORG

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Subject:
From:
Brandon Zimmer <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 7 Mar 2007 15:58:51 -0500
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We are beginning to test some lead-free products and one of the parameters I am curious about is reflow profiling, specifically the differences between ramp-soak-spike and ramp-to-spike.
 
Has anyone moved from a RSS to RTS because of the switch to lead-free solder?  Or vice-versa?
 
I would appreciate any information.
 
Thanks,
Brandon Zimmer

PCB Production Engineering
New Sabina Industries, Inc.

 
 

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