Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Tue, 20 Mar 2007 16:17:57 -0700 |
Content-Type: | text/plain |
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Bob,
Are you referring to solder mask, or tenting vias "via plug use in
Vacuum ICT fixtures"
Both have no issue that I'm aware off, have used them in the past no issues
Regarding blow hole, this is a concern mostly by via filled using
conductive fill material.
Best bet is to ask your Fab shop, or assembly house for data to back
this up.
-Patrick
Silicon Valley Chapter - IPC wrote:
> I am sure this topic has been discussed before...
>
> What is the latest pros/cons concerning the masking of vias?
>
> At one time there were concerns about trapped air/gas and the possibility
> of it popping. Is this fact or myth?
>
> Any information with supporting data would be most appreciated.
>
> Thanks in advance!
>
> Bob McCreight, C.I.D.
>
>
>
>
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--
Patrick Jabbaz
Ubiquiti Networks
495-499 Montague Expwy
Milpitas, CA 95035
T: (408) 942-3085
M: (408) 621-6533
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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