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Date: | Tue, 6 Mar 2007 11:52:11 EST |
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Hi Leland,
John Maxwell gave you good input—I really cannot add to it in a meaningful
way.
Thinking about it some more, the real answer is to minimize the probability
of CC cracking by design—see my column Engelmaier, W., “Lead-Free (LF)
Wave-Soldering: Can (Should) It Be Eliminated,” Global SMT & Packaging, Vol. 5, No.
9, October 2005, pp. 46-50.
Werner
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