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March 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 6 Mar 2007 11:52:11 EST
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Hi Leland,
John Maxwell gave you good input—I really cannot add to it in a meaningful 
way.
 Thinking about it some more, the real answer is to minimize the probability 
of CC cracking by design—see my column Engelmaier, W., “Lead-Free (LF) 
Wave-Soldering: Can (Should) It Be Eliminated,” Global SMT & Packaging, Vol. 5, No. 
9, October 2005, pp. 46-50.

Werner


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