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Date: | Fri, 30 Mar 2007 09:44:32 -0700 |
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Actually yes.
If you put solder resist over the lands for the BGA you have by definition a
joint defined by the resist system.
Effectively this will give you a 90 degree wetting angle which is - you
guessed it a stress riser.
So a joint with solder mask defined joints will be more liable to crack
under stress.
John
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Friday, March 30, 2007 9:02 AM
To: [log in to unmask]
Subject: [TN] Solder Resist Encroachment onto BGA pads
Hello All,
Does anybody know why IPC does not allow any solder resist encroachment
onto the BGA copper defined lands for PCBs?
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