I'll follow you in the sky, with a camera and a joystick!
Inge
http://www.youtube.com/watch?v=pz0XNGJ-ep8
----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 16, 2007 11:12 AM
Subject: Re: [TN] Gold Ball Bond attaching surface roughness
Okay Ingemar,
Are you putting the ball on the [nail head?] pin, or the wedge? I bet
your plating/plater has a lot to do with your success :-)
Sometimes you crack me up!
I need the weather to calm down so I can go flying. Starting to grow
roots have been on the ground so long. Finally loosing enough snow that
I might be able to get out on the field.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, March 15, 2007 5:18 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Ball Bond attaching surface roughness
Copper Cup...when is that?
Sorry, I know you are not to play with until on Friday.
Even if the surface you are looking at may seem rough in a macro-looking
perspective, the micro ditto may serve well for the ball or wedge.
Hence, we
do bonding on rough glass feed-true pins, which are absolutely not
thought
for bonding, but it works fine. Try! And do pull test!
Inge
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>; <[log in to unmask]>
Sent: Thursday, March 15, 2007 7:48 PM
Subject: RE: [TN] Gold Ball Bond attaching surface roughness
The application I am referring to is a device where the ball bond, BCC,
is placed on a copper cup which also serves as the solder fillet to the
PWB pad.
This cup is really rough exhibiting tooth like structure similar to
those of the vendor treated side on copper foil.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, March 15, 2007 12:23 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Ball Bond attaching surface roughness
Agree with Trikeman, the semi process is a epitaxial process using
"refractory" metal, and the asperity is not measureable on normal
tallysurfers, i.e. <0.1 um. Only situation may be with semi chips with
plated bond pads, but then we talk gold. And these have never caused us
any
problems either. You needn't bother. /Inge
----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 15, 2007 1:36 PM
Subject: Re: [TN] Gold Ball Bond attaching surface roughness
Victor,
Sorry, don't have a number to give you. We do it all day long ... and
the IC mfr's know how to make the bond pads....
Typically smoother is better, but if one were to look at the plating on
a lead frame at high enough magnification, it is certainly not smooth
either.
Possibly someone has some form of spec on the surface finish of a bond
pad. All that I am aware of is pad thickness.
If no one has a surface finish number, I might be able to run some next
week.
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Thursday, March 15, 2007 8:25 AM
To: [log in to unmask]
Subject: [TN] Gold Ball Bond attaching surface roughness
Fellow TechNetters:
Typically I have observed ball bond attached the alunium window of a
chip, and copper lead frame. Are there any criteria for the roughness
of this surface for establishing a good intermetallic formation?
Victor,
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