LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

March 2007

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET March 2007

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives
Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]
Subject:	Re: Gold Ball Bond attaching surface roughness
From:	Inge <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:	Thu, 15 Mar 2007 22:31:26 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (215 lines)
pigeon

Inge


----- Original Message ----- 
From: "Victor G. Hernandez" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 15, 2007 9:26 PM
Subject: Re: [TN] Gold Ball Bond attaching surface roughness


How do I send a photo to steve z.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
Sent: Thursday, March 15, 2007 1:51 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Ball Bond attaching surface roughness

Victor,

I am not sure what you are attempting to describe.  Can you explain
further, or get a picture to Steve Z?

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Thursday, March 15, 2007 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Ball Bond attaching surface roughness

The application I am referring to is a device where the ball bond, BCC,
is placed on a copper cup which also serves as the solder fillet to the
PWB pad.
This cup is really rough exhibiting tooth like structure similar to
those of the vendor treated side on copper foil.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, March 15, 2007 12:23 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Ball Bond attaching surface roughness

Agree with Trikeman, the semi process is a epitaxial process using
"refractory" metal, and the asperity is not measureable on normal
tallysurfers, i.e. <0.1 um.  Only situation may be with semi chips with
plated bond pads, but then we talk gold. And these have never caused us
any
problems either. You needn't bother. /Inge

----- Original Message ----- 
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 15, 2007 1:36 PM
Subject: Re: [TN] Gold Ball Bond attaching surface roughness


Victor,

Sorry, don't have a number to give you.  We do it all day long ... and
the IC mfr's know how to make the bond pads....

Typically smoother is better, but if one were to look at the plating on
a lead frame at high enough magnification, it is certainly not smooth
either.

Possibly someone has some form of spec on the surface finish of a bond
pad.  All that I am aware of is pad thickness.

If no one has a surface finish number, I might be able to run some next
week.

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Thursday, March 15, 2007 8:25 AM
To: [log in to unmask]
Subject: [TN] Gold Ball Bond attaching surface roughness

Fellow TechNetters:

Typically I have observed ball bond attached the alunium window of a
chip, and copper lead frame.   Are there any criteria for the roughness
of this surface for establishing a good intermetallic formation?

Victor,

-----------------------------------------------------

THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS
SENT
FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED ONLY
FOR
THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If you are not
the
intended recipient, you are hereby notified that any review,
distribution,
or copying of this communication is strictly prohibited.  If you have
received this communication in error, please immediately notify the
sender
by return e-mail, and delete this e-mail message and any attachments
from
your computer.


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS
SENT FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED
ONLY FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If
you are not the intended recipient, you are hereby notified that any
review, distribution, or copying of this communication is strictly
prohibited.  If you have received this communication in error, please
immediately notify the sender by return e-mail, and delete this e-mail
message and any attachments from your computer.




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
ATOM RSS1 RSS2
LISTSERV.IPC.ORG