Victor,
we follow the rule, that no voids are allowed for MIL/SPACE products. Many
standards say, that the bond material, either solder or adhesive, shall be
100% visible all around the chip. Normally, if you apply that rule, there
use to be no voids. Voids can have a negative impact on devices that produce
a lot of heat, like processors, ASICS and power devices. However, you always
get the question ' what is no voids like, can't even 10um voids be accepted?
'. In that case, I have never seen a quantification. I think common sense
should be used. If the voids are so large, that they are clearly seen with
ultrasonic scans, you may draw the conclusion, that those packages should
not be classified as good ones.
Example:
http://xweb.nrl.navy.mil/glast/CALDesign/CDE/GLAST%20LAT%20CAL%20Dual%20PIN%20Photodiode%20Spec%20LAT-DS-00209-11a.pdf
Inge
----- Original Message -----
From: "Victor G. Hernandez" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, March 13, 2007 12:55 PM
Subject: [TN] BGA Die Attach Criteria
Fellow TechNetters:
Where can I locate die attach requirements for a BGA. I see some
die attach voiding at the corner of the die and appear wrinkle.
Victor,
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|