Sender: |
|
X-To: |
|
Date: |
Thu, 29 Mar 2007 10:51:23 -0400 |
Reply-To: |
|
Subject: |
|
From: |
|
Content-Transfer-Encoding: |
quoted-printable |
In-Reply-To: |
|
Content-Type: |
text/plain; charset="us-ascii" |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Straight forward board to build with folks experienced in hybrid builds.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pasquito, Helena
Sent: Thursday, March 29, 2007 10:11 AM
To: [log in to unmask]
Subject: Re: [TN] Via aspect ratio in mixed dielectric PCB's
Hello Werner,
1. Board is hybrid construct .083" thick +/- .007"
2. Top .030" is Taconics RF-35-0300-C1/C1; an RF/microwave woven
laminate
3. Remaining .053" is combination of FR406 Cores and prepregs.
4. Vias are drilled at .014" thru the full stack-up and are specd to be
plated with .001" min Cu.
Vias and outer surfaces are to be finished with 3-10uin Au over
150-200uin Ni.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, March 28, 2007 5:00 PM
To: [log in to unmask]
Subject: Re: [TN] Via aspect ratio in mixed dielectric PCB's
Hi Helena,
You do not explain what "Taconics material" is and what its properties
are.
Just generally speaking, if you have an asymmetric lay-up, you are prone
to
PCB warpage, particularly with LF-soldering T's.
Werner
**************************************
See what's free at http://www.aol.com.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|