Presented by Happy Holden / Mentor Graphics
HDI ROUTING HIGHLIGHTS AND INSIGHTS
Tuesday, March 27; 12:00 PM to 2:00 PM (FREE)
Room 210
PCB Design Conference West 2007
Santa Clara, CA
DESCRIPTION: This is a short overview and introduction to an advanced PCB technology, High Density Interconnects (HDI) or as it is called, Microvia or Build-Up Technology. Two growing product focuses, miniaturization and ball grid arrays, have come into common use, and created the need for advanced printed wiring boards (PWB) - - both as the board and as the package. This short discussion looks at basic technologies for HDI routing of portable products, high performance computing, telecom and dense System-In-Package (SiP) modules. PWB wiring stackups, design rules, and selection of PWB microvia structures will be examined and compared. The program will define how to select circuit routing guidelines, manufacturing process features to permit the use of widely accepted fine pitch and high I/O BGA components. Participants are encouraged to bring along their technical questions for discussion.
Who Should Attend: Project Managers, design and hardware engineers, field support personnel, pcb layout, design, process, failure analysis, and reliability engineers, others.
Topics: AGENDA for Seminar 12:00 pm
What is microvia technology and how long has it been around?
When should we use ìvias?: Density, Reliability, Weight/Size. Electrical Performance
Examples of through-hole boards converted to ìvia designs.
Implementation, design rules and IPC Standards.
Channel and Boulevard Trace Routing for BGAs?
Which constructions are possible?
High I/O and Fine-pitch BGA routing with ìvias.
Layer Reduction Strategies
INSTRUCTOR: Happy Holden, Mentor Graphics-SDD Longmont, CO
Happy Holden is Senior PCB Technologist for Advanced Technologies for Mentor Graphics. He is responsible for customer consulting and roadmaps for next generation Printed Circuit Manufacturing Technologies, advanced design tools and design consulting. Prior to joining Mentor, he was a consultant with Westwood/NanYa PCB, TechLead Corporation and Merix, and had retired from Hewlett-Packard after over 30 years. Mr. Holden formerly managed Hewlett-Packard's application organizations in Taiwan and Hong Kong and printed circuits R+D. He is a frequent speaker on Printed Circuit Topics and Packaging Strategies and has had over 90 technical papers published on automation, printed circuits, advanced packaging, DFM and process engineering and chapter in three PCB Books. He is a member of IEEE, IPC, SMTA, and IMAPS.
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This seminar is FREE!
BRING YOUR OWN LUNCH, LEARN WHILE YOU MUNCH
Reserve your seat today, send e-mail to [log in to unmask]
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