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Sender:	DesignerCouncil <[log in to unmask]>
X-To:	Designers Council Forum <[log in to unmask]>, Silicon Valley Chapter - IPC <[log in to unmask]>
Date:	Tue, 20 Mar 2007 16:17:57 -0700
Reply-To:	"(Designers Council Forum)" <[log in to unmask]>, Patrick Jabbaz <[log in to unmask]>
Subject:	Re: Soldermask over vias?
From:	Patrick Jabbaz <[log in to unmask]>
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Bob,
Are you referring to solder mask, or tenting vias "via plug use in 
Vacuum ICT fixtures"
Both have no issue that I'm aware off, have used them in the past no issues
Regarding blow hole, this is a concern mostly by via filled using 
conductive fill material.
Best bet is to ask your Fab shop, or assembly house for data to back 
this up.

-Patrick

Silicon Valley Chapter - IPC wrote:
> I am sure this topic has been discussed before...
>    
>   What is the latest pros/cons concerning the masking of vias?
>    
>   At one time there were concerns about trapped air/gas and the possibility
>   of it popping. Is this fact or myth? 
>    
>   Any information with supporting data would be most appreciated.
>    
>   Thanks in advance!
>    
>   Bob McCreight, C.I.D.
>    
>   
>  
>
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>   

-- 
Patrick Jabbaz
Ubiquiti Networks
495-499 Montague Expwy
Milpitas, CA 95035
T: (408) 942-3085
M: (408) 621-6533 

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