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Impacts of Fine Pitch BGA/CSP Devices
The Greater Boston Chapter of the IPC Designer's Council is
holding its next meeting on Wednesday, Mar 14th at 6pm in the
conference room at iRobot in Burlington MA.
Javier Villa, Engineering Manager with Gorilla Circuits, will
present on the challenges of fine pitch (sub .8mm) components.
With components having long passed 1mm and finer pitch arrays,
the march to higher densities presents real challenges to real
world mounting and routing. Add in goals such as high elec-
trical speeds and volume production needs and the designer is
faced with finding a very narrow path to success. Fine lines
and spaces may be widely advertised but frequently can't be
put next to each other, or need to use very thin copper, in-
troducing yet more concerns. Too large an array at too fine a
pitch and microvias only move the problem down a layer. What
questions should we be asking our fabricators?
Mr Villa holds a Masters Degree in Chemical Engineering as well
as a Six Sigma Black Belt Certification. He has 10 years ex-
perience in PCB manufacturing. Prior to Gorilla Circuits,
Javier was an engineering manager for Sanmina's Tech Center
West. He has been recognized as an innovator in PCB process
development, having received awards from Cisco, HP, and Tellabs.
Gorilla Circuits is the longest established board house in Cali-
fornia's Silicon Valley, producing quick-turn, prototype, and
pre-production boards for the most demanding customers.
Agenda:
6:00 pm, Arrivals/Pizza, sponsored by Gorilla Circuits
6:30 Jeff Seeger - Chapter Update
6:45 Javier Villa, Fine Geometry PCBs
Location:
iRobot, 63 South Ave, Burlington MA. Directly across from
the Burlington Mall just off of Middlesex Turnpike; South
Ave has Long's Jeweler's on the corner. As you proceed up
South Ave, iRobot's front door is at the first left.
RSVP's needed:
Please RSVP to Jeff Seeger [log in to unmask] , if you
are bounced by a spam blocker please call me @978 649 9800
before Wednesday noon, 14-Mar. We need this in order to
plan the refreshments.
President's Note:
The matriculation of components out of the handheld realm
and the relentless march of Moore's Law are moving tech-
nology normally deployed on build-up multilayer squarely
into the organic board mainstream. Accommodating today's
devices on boards with routine manufacturing techniques
is tricky at best, and maintaining producability serves to
compound the issues. If you're not facing devices at less
than .8mm pitch already, you will soon enough. Be ready!
Mission:
The physical design of circuit boards is only getting more
complex. Only the physical designer can hope to sort out
the myriad interests that add up to a printed circuit board.
The Greater Boston Chapter of the IPC Designer's Council
is trying to bring the stake holders from every discipline,
to show you their problems and solutions so you can add to
your arsenal of knowledge.
Your help and participation would be most appreciated, how
about getting involved!
Thanks and regards,
Jeff Seeger, CTO, Applied CAD Knowledge Inc.
President, Greater Boston Chapter, IPC Designer's Council
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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