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February 2007

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Fri, 9 Feb 2007 07:49:53 -0800
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Well I could let them know what the result would be from my email
inbox........But FYI the NPL in UK are running a collaborative study on the
effect of lead free temp reflow on large plastic body device stability, see
below for link.

Kind regards, 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: SMART Group smart-e-link [mailto:[log in to unmask]] On
Behalf Of Tony Gordon
Sent: Friday, February 09, 2007 6:45 AM
To: [log in to unmask]
Subject: [SMART] NPL Studio Project

Dear Colleague,

The National Physical Laboratory is launching a new collaborative studio 
project with industry to investigate the Effect of Lead-free Soldering 
Temperatures on Large Plastic Components Stability.

You are invited to join

Further details can be found in 
http://www.npl.co.uk/ei/studio/stability/stability2.pdf

Response deadline: Thursday 1 March 2007

For further information contact:
Chris Hunt
Tel: +44(0)208 943 7027
[log in to unmask]

Martin Wickham
Tel: +44(0)2392 719288
[log in to unmask]

Tony Gordon
SMART Group
85 Easton Street
High Wycombe
Bucks
HP11 1LT
Tel 01494 465217
Fax 01494 473975
Mob 07860 533426
e-mail [log in to unmask]
Lead Free Training www.smartgroup.org/pdf/smartlftraining.pdf
The Future www.smartgroup.org/pdf/future2007.pdf
Lead Free Ireland www.smartgroup.org/pdf/lfireland07.pdf
Cleaning Day www.smartgroup.org/pdf/cleaning.pdf
Printing www.smartgroup.org/pdf/printreflow.pdf 

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