I think it will be a continuing saga... Stay tuned for the next episode,
to be published sometime later.
Blair Hogg, WB3AWI
Director of Continuous Improvement
GAI-Tronics Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Upton, Shawn
Sent: Friday, February 09, 2007 7:53 AM
To: [log in to unmask]
Subject: Re: [TN] FW: Report from a BGA
I wanted to see where that story went, but I could not find the next
report. Is there more to the story than just the one page link below?
Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, February 09, 2007 2:43 AM
To: [log in to unmask]
Subject: Re: [TN] FW: Report from a BGA
Yeah, that story was from the real world.
Just now, I'm involved in a investigation of BGA interrupts. The BGA is
LF and it's a LF soldering process. A few boards per one hundred show
insufficient soldering or no wetting at all on some 5-10 positions
(balls).
Our vapour phase line is free from problems, even with superBGAs as big
as 2,500 balls. The problems occur in the conduction oven line, and
these are not superBGAs, but much smaller ones.
I may add some results later.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: den 8 februari 2007 22:24
To: [log in to unmask]
Subject: Re: [TN] FW: Report from a BGA
Thanks John! It's nice to know we're not the only one with our balls on
the line.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, February 08, 2007 1:12 PM
To: [log in to unmask]
Subject: [TN] FW: Report from a BGA
Thanks to Ryan Jazz Jayasinghe for sending me this link.
Report from a BGA By Lars Wallin, IPC European Representative Jan 25,
2007
http://www.emsnow.com/npps/story.cfm?ID=24434
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