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February 2007

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Fri, 9 Feb 2007 08:34:06 -0500
Content-Type:
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	BGAs are one of the weakest links. They are going to cause major
rethinking on the LF process on the part of many major companies.
Perhaps they will Push Back?
	Ramon 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, February 09, 2007 2:43 AM
To: [log in to unmask]
Subject: Re: [TN] FW: Report from a BGA

 Yeah, that story was from the real world. 

Just now, I'm involved in a investigation of BGA interrupts. The BGA is
LF and it's a LF soldering process. A few boards per one hundred show
insufficient soldering or no wetting at all on some 5-10 positions
(balls). 

Our vapour phase line is free from problems, even with superBGAs as big
as 2,500 balls. The problems occur in the conduction oven line, and
these are not superBGAs, but much smaller ones.

I may add some results later.

Inge


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: den 8 februari 2007 22:24
To: [log in to unmask]
Subject: Re: [TN] FW: Report from a BGA

Thanks John! It's nice to know we're not the only one with our balls on
the line.
Dewey


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, February 08, 2007 1:12 PM
To: [log in to unmask]
Subject: [TN] FW: Report from a BGA

 

Thanks to Ryan Jazz Jayasinghe   for sending me this link.      

 

 

Report from a BGA By Lars Wallin, IPC European Representative  Jan 25,
2007
http://www.emsnow.com/npps/story.cfm?ID=24434

 


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