TN strips off attachments. I'd suggest you sent the photo
Gary,
TN strips off attachments. I'd suggest you sent the photograph to Steve
(see Cc) and have him post it on his web site and that way those on TN
can view it.
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer
Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bremer, Gary
Sent: Thursday, February 01, 2007 11:02 AM
To: [log in to unmask]
Subject: [TN] Mechanical Stress on solder joints
Gentlemen,
I have a device that failed in the field, the part is a DC/DC converter
that is first soldered to the circuit board then a massive heatsink is
screwed to the converter pulling the device upward because of an air gap
not covered by a thermal conductive pad. Could this be the cause of
damage to the component pins as shown in the attached photo? The solder
used is Sn63 on the circuit board side and the mass of the board solder
joint appears to be twice that of the component.
Gary Bremer
Senior Manufacturing Engineer, CIT
Curtiss-Wright Controls Inc.
Embedded Computing -Subsystem
28965 Avenue Penn
Santa Clarita, CA 91355-4185
Main: 661.257.4430 extension 2170
Fax: 661.257.4782
e-mail: [log in to unmask]
Web: www.cwcembedded.com
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