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February 2007

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
Date:
Wed, 7 Feb 2007 06:59:34 -0500
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This would be paste dependent and, it would depend on process factors, max
allowed open jar life of the paste, max time between print, place and reflow
come to mind. 

Starting March 1, 2007 New Location
Guy Ramsey
R&D Assembly
1660 East Race Street
Allentown PA 18109-9580
(610) 264-1887
FAX (610) 264-1877
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sklenar Vit
(RBAU-AE/MFE3)
Sent: Tuesday, February 06, 2007 8:19 PM
To: [log in to unmask]
Subject: [TN] Max Humidity allowed

Hi Techneters,

Please  is anybody aware or can you refer me to  any standard which
addresses the maximum allowed  humidity  in electronic production  in
order to prevent  microballs creation during reflow process?

Thank you fro your reply

Vit Sklenar
Robert Bosch (Australia) Pty. Ltd. 
RBAU/MF33 - VS, Process Eng.) 
www.bosch.com.au 

Tel. +613 9541 7734
Fax +613 9541 3909
[log in to unmask] 2
 

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