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February 2007

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Subject:
Re: Max Humidity allowed
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Wed, 7 Feb 2007 09:58:10 +0200
Content-Type:
text/plain
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text/plain (45 lines) 
Surely that depends on the chemistry of the paste, the hold time before 
and after the component assembly and before reflow, as much as the RH?

Brian

Sklenar Vit (RBAU-AE/MFE3) wrote:
> Hi Techneters,
> 
> Please  is anybody aware or can you refer me to  any standard which
> addresses the maximum allowed  humidity  in electronic production  in
> order to prevent  microballs creation during reflow process?
> 
> Thank you fro your reply
> 
> Vit Sklenar
> Robert Bosch (Australia) Pty. Ltd. 
> RBAU/MF33 - VS, Process Eng.) 
> www.bosch.com.au 
> 
> Tel. +613 9541 7734
> Fax +613 9541 3909
> [log in to unmask] 2
>  
> 
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