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February 2007

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Subject:
From:
"Bremer, Gary" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bremer, Gary
Date:
Thu, 1 Feb 2007 08:02:27 -0800
Content-Type:
text/plain
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text/plain (53 lines)
Gentlemen,

 

I have a device that failed in the field, the part is a DC/DC converter
that is first soldered to the circuit board then a massive heatsink is
screwed to the converter pulling the device upward because of an air gap
not covered by a thermal conductive pad. Could this be the cause of
damage to the component pins as shown in the attached photo? The solder
used is Sn63 on the circuit board side and the mass of the board solder
joint appears to be twice that of the component.

 

Gary Bremer
Senior Manufacturing Engineer, CIT
  
Curtiss-Wright Controls Inc. 
Embedded Computing -Subsystem

28965 Avenue Penn
Santa Clarita, CA 91355-4185
Main: 661.257.4430 extension 2170
Fax: 661.257.4782


e-mail: [log in to unmask]
Web: www.cwcembedded.com 

NOTICE: This e-mail communication is private and confidential and is
intended for the addressee only. The email may only be used for
conducting business with VISTA Controls Inc., dba Curtiss-Wright
Controls Embedded Computing Subsystems. If you are not the intended
recipient, please notify us by replying to this email followed by
deleting the email and all attachments from your system. Anyone other
than the intended recipient or those with a need to know within the
recipient's organization is strictly prohibited from using, printing,
distributing or disseminating the email or any information or attachment
contained therein.

 


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