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February 2007

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Subject:
From:
"Louis, Edwin @ CSE" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis, Edwin @ CSE
Date:
Tue, 6 Feb 2007 13:58:31 -0500
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How is Joe Kane doing?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E (US
SSA)
Sent: Tuesday, February 06, 2007 11:23 AM
To: [log in to unmask]
Subject: [TN] Plasma Surface Treatment For Conformal Coat

While we're on the subject of CC, does anybody use plasma to
remove stubborn organic residues (e.g. silicones) from board
surfaces, or otherwise change the surface energy to promote
coating adhesion?

We're not talking about long or aggressive exposure here, just
enough to remove a thin layer of contaminant, or roughen the surface 
of a glossy soldermask.  So I'm not much concerned about removing
markings or anything, but are there any other potential pitfalls?

Joe Kane
BAE Systems
Johnson City, NY

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