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February 2007

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Subject:
From:
"Kane, Joseph E (US SSA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Joseph E (US SSA)
Date:
Tue, 6 Feb 2007 11:22:55 -0500
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While we're on the subject of CC, does anybody use plasma to
remove stubborn organic residues (e.g. silicones) from board
surfaces, or otherwise change the surface energy to promote
coating adhesion?

We're not talking about long or aggressive exposure here, just
enough to remove a thin layer of contaminant, or roughen the surface 
of a glossy soldermask.  So I'm not much concerned about removing
markings or anything, but are there any other potential pitfalls?

Joe Kane
BAE Systems
Johnson City, NY

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