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February 2007

TechNet@IPC.ORG

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Thu, 1 Feb 2007 10:02:51 -0000
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Just for late completeness: it will also depend on whether you are hand
soldering, reflowing paste or wave soldering. Wave will wash a lot of the
gold away [and dilute it into the solder pot before redepositing it],
whereas hand or paste will just ad a finite amount of Sn to mix with the
gold.  



Regards 

Mike 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 31, 2007 7:32 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Karen,
You won't find it because it does not exist.  You want less than 4% by
weight in the final joint for sure.  Dr. Cotts of SUNY Binghampton would
argue for much less.

The reason you won't find a lead plating limit is that the results will
depend on:
1) lead size
2) pad size
3) stencil thickness

These will all affect the final joint concentration.

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner
Sent: Wednesday, January 31, 2007 2:01 PM
To: [log in to unmask]
Subject: [TN] Maximum Au lead plating thickness

Hi 

We are looking for the IPC spec that calls out the maximum Au plating 
thickness on leads in order to prevent Au embrittlement.

Can anyone provide this to me.

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